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X16c vs. X16e vs. X16p?


Ju+Te
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It refers to the stage of development - each stage will result in a X16 with a distinct hardware implementation. The FAQ  says the details are in the second video, but I can't seem to find where the 8 Bit Guy covers it specifically. I'd suggest that reading the FAQ and watching the videos will give you a better idea than I can.

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X16p is the one you are seeing prototypes of. All new, in production through-pin kit-buildable ASIC except for the board holding the Vera chip subsystem and the "new-used" FM sound chip. Chip select done by a circuit mostly made up of glue logic. A lot of the complex ASIC socketed. No CPLD/FPGA other than Vera standing in for the specialized video chip that would have been made for a system like this, "back in the day". Four slots. Sockets for up to 4 512KB SRAM chips.

X16c is a cost reduced version of the X16p. EG, surface mount chips, to allow building with a chip placer robot. Likely one soldered surface mount SRAM (but there are fast enough SRAM larger than 512KB available in surface mount form factors). The Vera subsystem integrated into the single board. Likely only one or two slots. Possibly replacing the glue logic chip select with a CPLD. NOTE that the specifics of the CX16c are not as clear cut as the CX16p, since some details in the design decisions have never been announced ... and quite possibly have not yet been made ... but the mostly surface mount versions of the same chips, a smaller form factor, much easier to build in a modern chip-placer and solder oven system, to aim for a lower board cost than the CX16p.

X16e is the one that puts as much as possible into a single FPGA, while remaining software compatible with the X16p/c. Details are even fuzzier than the X16c, since it would be the last one to be developed (if ever).

 

Edited by BruceMcF
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On 9/29/2021 at 2:24 PM, BruceMcF said:

X16p is the one you are seeing prototypes of. All new, in production through-pin kit-buildable ASIC except for the board holding the Vera chip subsystem and the "new-used" FM sound chip. {stuff deleted for brevity}

Are you saying that X16p is “IN PRODUCTION”, meaning that a quantity are being produced for sale?

If so, that’s great news!!

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I don't think @BruceMcF is saying the units are being made yet; he's qualifying that the boards shown in the videos are of prototypes of what will evolve to become the production model. The team making the X16 has not announced that it is in production yet. The FAQ suggest that there with be some sort of crowdfunding to get the computer into that stage. We'll all be excited when that happens, more so when those who buy the X16p receive and assemble it.

 

Edited by Edmond D
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On 9/29/2021 at 6:55 PM, EMwhite said:

Are you saying that X16p is “IN PRODUCTION”, meaning that a quantity are being produced for sale?

If so, that’s great news!!

Nope. He said that it uses “in production” chips, meaning that all of the parts going into the prototypes and eventual production model are chips you can go buy right now. 

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On 9/30/2021 at 12:51 AM, EMwhite said:

Ah, my mistake.  I thought he was part of the design team, in the know, and quietly leaking that something was happening. nm 

I am NOT part of the design team! If I was, I would have spilled hundreds of words on the MegaThread hoping for one tweak to the X8 design!

And yes, "All new, in production through-pin kit-buildable ASIC except for" meaning mostly in production, through hole chips ... the only chips not in production are the FM synthesis chips (they are a pair, the wave form generator and its accompanying DAC), and the only ones that are not through-hole DIP chips are the ones on the Vera module, where the discussed plan for a kit version is that the kit comes with a complete module, the kit builder solders in the pin header blocks, and squints and pretends they are putting a chip into a socket when they plug the Vera board into the pin header blocks.

 From watching the way the design team works over the past few years, "in production" is not going to be leaked, it's going to be a headline announcement in the official announcement forum!

Edited by BruceMcF
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